CMP

GM200/300S is low cost tool designed to detect metal residue tungsten or copper post CMP.

The tool can used as standalone or integrated.

Specification:

  • Designed to operate in clean room class 1
  • Small foot print: 80X90 cm
  •  100% inspection of the wafer area
  • Identifies metal remaining greater then 25X25u on the front size of the wafer
  •  In the integrated version: no impact on the performance host tool throughput
  •  24/7 operating time
  •  Tool designed and operates according to the semi regulations
  •  Secs/Gem Interface
  •  Fast handler and smart image processing allow throughput up to 160wph in the standalone version.
  •  Improve yield
  •  Low cost and very short ROIafterbefor