TYTO200/300S is low-cost stand-alone tool derived from the AMI tool, which is designed to detect defects after

the final process is completed. After the test is completed, the tool can package the wafers automatically into the jar.


  • Small footprint: 170X80 cm
  • 100% inspection of the wafer area of the front side
  •  Identifies a wide range of macro defects during the process.
  •  Operational 24/7
  • Unique handler tool
  • Design and performance adhere to semi regulations
  • Secs/Gem Interface
  •  Fast handler and smart image processing allow throughput of up to 100 wph
  •  Improved yield
  •  Low cost and very short ROI